Integrated circuit with contact region and multiple etch stop insulation layer | Patent Publication Number 20090294969

US 20090294969 A1
Patent NumberUS 07977797 B2
Application Number12539480
Filled DateAug 11, 2009
Priority DateSep 2, 2004
Publication DateDec 3, 2009
Original AssigneeSpansion Llc
Current AssigneeMorgan Stanley Senior Funding Inc.
Inventor/ApplicantsDawn HOPPER
Angela T. Hui
Dawn Hopper
Kouros Ghandehari
Kouros GHANDEHARI
Wenmei Li
Wenmei LI
Angela T. HUI
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