Stacked chip connection using stand off stitch bonding | Patent Application Number 10002175

10002175
Not Appealed
Patent NumberUS 07021520 B2
Publication NumberUS 20030102358 A1
Filled DateDec 5, 2001
Priority DateDec 5, 2001
Inventor/ApplicantsNeal M. Bowen
Neal M. Bowen
ExaminesEDMONDSON, LYNNE RENEE
Art Unit1725
Technology Center1700
Assignments
Round Rock Research
Current
Micron Technology Inc.
Original
Law Firm
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