Stacked chip connection using stand off stitch bonding | Patent Number 07021520

US 07021520 B2
Application Number10002175
Publication NumberUS 20030102358 A1
Pendency4 years, 4 months, 1 day
Filled DateDec 5, 2001
Priority DateDec 5, 2001
Publication DateJun 5, 2003
Expiration DateDec 5, 2021
Inventor/ApplicantsNeal M. Bowen
Neal M. Bowen
ExaminesEDMONDSON, LYNNE RENEE
Art Unit1725
Technology Center1700
Assignments
Round Rock Research
Current
Micron Technology Inc.
Original
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