Stacked chip connection using stand off stitch bonding | Patent Publication Number 20030102358

US 20030102358 A1
Patent NumberUS 07021520 B2
Application Number10002175
Filled DateDec 5, 2001
Priority DateDec 5, 2001
Publication DateJun 5, 2003
Original AssigneeMicron Technology Inc.
Current AssigneeRound Rock Research
Inventor/ApplicantsNeal M. Bowen
Neal M. Bowen
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