Reconfigurable processor module comprising hybrid stacked integrated circuit die elements | Patent Application Number 10452113

10452113
Not Appealed
Patent NumberUS 06781226 B2
Publication NumberUS 20040000705 A1
Filled DateJun 2, 2003
Priority DateDec 5, 2001
Inventor/ApplicantsJon M. Huppenthal
Jon M. Huppenthal
D. James Guzy
D. James Guzy
ExaminesCHANG, DANIEL D
Art Unit2819
Technology Center2800
Assignments
Arbor Global
Current
Arbor Pharmaceuticals
Original
Law Firm
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