Reconfigurable processor module comprising hybrid stacked integrated circuit die elements | Patent Publication Number 20040000705

US 20040000705 A1

Patent NumberUS 06781226 B2

Application Number10452113

Filled DateJun 2, 2003

Priority DateDec 5, 2001

Publication DateJan 1, 2004

Original AssigneeArbor Pharmaceuticals

Current AssigneeArbor Global

Inventor/ApplicantsJon M. Huppenthal
Jon M. Huppenthal
D. James Guzy
D. James Guzy

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