Reconfigurable processor module comprising hybrid stacked integrated circuit die elements | Patent Number 06781226

US 06781226 B2
Application Number10452113
Publication NumberUS 20040000705 A1
Pendency1 year, 2 months, 24 days
Filled DateJun 2, 2003
Priority DateDec 5, 2001
Publication DateJan 1, 2004
Expiration DateDec 5, 2021
Inventor/ApplicantsD. James Guzy
Jon M. Huppenthal
Jon M. Huppenthal
D. James Guzy
ExaminesCHANG, DANIEL D
Art Unit2819
Technology Center2800
Assignments
Arbor Global
Current
Arbor Pharmaceuticals
Original
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