Reconfigurable processor module comprising hybrid stacked integrated circuit die elements | Patent Application Number 10802067

10802067
Not Appealed
Patent NumberUS 07126214 B2
Publication NumberUS 20040177237 A1
Filled DateMar 16, 2004
Priority DateDec 5, 2001
Inventor/ApplicantsD. James Guzy
Jon M. Huppenthal
D. James Guzy
Jon M. Huppenthal
ExaminesCHANG, DANIEL D
Art Unit2819
Technology Center2800
Assignments
Arbor Global
Current
Arbor Pharmaceuticals
Original
Law Firm
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