Reconfigurable processor module comprising hybrid stacked integrated circuit die elements | Patent Number 07126214

US 07126214 B2
Application Number10802067
Publication NumberUS 20040177237 A1
Pendency2 years, 7 months, 12 days
Filled DateMar 16, 2004
Priority DateDec 5, 2001
Publication DateSep 9, 2004
Expiration DateDec 5, 2021
Inventor/ApplicantsJon M. Huppenthal
D. James Guzy
Jon M. Huppenthal
D. James Guzy
ExaminesCHANG, DANIEL D
Art Unit2819
Technology Center2800
Assignments
Arbor Global
Current
Arbor Pharmaceuticals
Original
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