Reconfigurable processor module comprising hybrid stacked integrated circuit die elements | Patent Publication Number 20040177237

US 20040177237 A1
Patent NumberUS 07126214 B2
Application Number10802067
Filled DateMar 16, 2004
Priority DateDec 5, 2001
Publication DateSep 9, 2004
Original AssigneeArbor Pharmaceuticals
Current AssigneeArbor Global
Inventor/ApplicantsJon M. Huppenthal
D. James Guzy
D. James Guzy
Jon M. Huppenthal
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