Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process | Patent Application Number 10953291

10953291
Appealed
Patent NumberUS 07221173 B2
Publication NumberUS 20060066327 A1
Filled DateSep 29, 2004
Priority DateSep 29, 2004
Inventor/ApplicantsTaeho Kook
Daniel Patrick Chesire
Mark Adam Bachman
Sailesh M. Merchant
ExaminesNGUYEN, TUNG X
Art Unit2829
Technology Center2800
Assignments
Bellnorthern Research
Current
Bell Semiconductor Llc
Current
Hilco Patent Acquisition 55 Llc
Current
Agere Systems BroadcomBroadcom
Original
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