Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process | Patent Publication Number 20060066327

US 20060066327 A1
Patent NumberUS 07221173 B2
Application Number10953291
Filled DateSep 29, 2004
Priority DateSep 29, 2004
Publication DateMar 30, 2006
Original AssigneeBroadcom
Current AssigneeBellnorthern Research
Bell Semiconductor Llc
Hilco Patent Acquisition 55 Llc
Inventor/ApplicantsTaeho Kook
Daniel Patrick Chesire
Mark Adam Bachman
Sailesh M. Merchant
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