Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process | Patent Number 07221173

US 07221173 B2
Application Number10953291
Publication NumberUS 20060066327 A1
Pendency2 years, 7 months, 25 days
Filled DateSep 29, 2004
Priority DateSep 29, 2004
Publication DateMar 30, 2006
Expiration DateSep 29, 2024
Inventor/ApplicantsDaniel Patrick Chesire
Mark Adam Bachman
Taeho Kook
Sailesh M. Merchant
ExaminesNGUYEN, TUNG X
Art Unit2829
Technology Center2800
Assignments
Bellnorthern Research
Current
Hilco Patent Acquisition 55 Llc
Current
Bell Semiconductor Llc
Current
Agere Systems BroadcomBroadcom
Original
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