Reconfigurable processor module comprising hybrid stacked integrated circuit die elements | Patent Application Number 11383149

11383149
Not Appealed
Patent NumberUS 07282951 B2
Publication NumberUS 20060195729 A1
Filled DateMay 12, 2006
Priority DateDec 5, 2001
Inventor/ApplicantsD. James Guzy
Jon M. Huppenthal
ExaminesCHANG, DANIEL D
Art Unit2819
Technology Center2800
Assignments
Arbor Global
Current
Arbor Pharmaceuticals
Original
Law Firm
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