Reconfigurable processor module comprising hybrid stacked integrated circuit die elements | Patent Publication Number 20060195729

US 20060195729 A1

Patent NumberUS 07282951 B2

Application Number11383149

Filled DateMay 12, 2006

Priority DateDec 5, 2001

Publication DateAug 31, 2006

Original AssigneeArbor Pharmaceuticals

Current AssigneeArbor Global

Inventor/ApplicantsD. James Guzy
Jon M. Huppenthal

Patent Prosecution report image

Empower your practice with Patexia Publication Prosecution IP Module.

Get access to our exclusive rankings and unlock powerful data.

Check our Latest Report Purchase IP Module

Looking for a Publication Attorney?

Get in touch with our team or create your account to start exploring a network of over 120K attorneys.