Reconfigurable processor module comprising hybrid stacked integrated circuit die elements | Patent Number 07282951

US 07282951 B2
Application Number11383149
Publication NumberUS 20060195729 A1
Pendency1 year, 5 months, 7 days
Filled DateMay 12, 2006
Priority DateDec 5, 2001
Publication DateAug 31, 2006
Expiration DateDec 5, 2021
Inventor/ApplicantsJon M. Huppenthal
D. James Guzy
ExaminesCHANG, DANIEL D
Art Unit2819
Technology Center2800
Assignments
Arbor Global
Current
Arbor Pharmaceuticals
Original
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