Hybrid gap-fill approach for STI formation | Patent Application Number 12032962

12032962
Appealed
Patent NumberUS 08187948 B2
Publication NumberUS 20090209083 A1
Filled DateFeb 18, 2008
Priority DateFeb 18, 2008
Inventor/ApplicantsChih-Hsiang Chang
Cheng-Yuan Tsai
Neng-Kuo Chen
Kuo-Hwa Tzeng
ExaminesMUSTAPHA, ABDULFATTAH B
Art Unit2812
Technology Center2800
Assignments
Taiwan Semiconductor Manufacturing Company
Current
Taiwan Semiconductor Manufacturing Company
Original
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