Hybrid gap-fill approach for STI formation | Patent Number 08187948

US 08187948 B2
Application Number12032962
Publication NumberUS 20090209083 A1
Pendency4 years, 3 months, 12 days
Filled DateFeb 18, 2008
Priority DateFeb 18, 2008
Publication DateAug 20, 2009
Expiration DateFeb 17, 2028
Inventor/ApplicantsChih-Hsiang Chang
Cheng-Yuan Tsai
Kuo-Hwa Tzeng
Neng-Kuo Chen
ExaminesMUSTAPHA, ABDULFATTAH B
Art Unit2812
Technology Center2800
Assignments
Taiwan Semiconductor Manufacturing Company
Current
Taiwan Semiconductor Manufacturing Company
Original
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