Local interconnect structures for high density | Patent Application Number 13829864
13829864
Not Appealed
Patent NumberUS 09024418 B2
Publication NumberUS 20140264629 A1
Filled DateMar 14, 2013
Priority DateMar 14, 2013
Inventor/ApplicantsJohn Jianhong Zhu
Giridhar Nallapati
PR Chidambaram
Giridhar Nallapati
PR Chidambaram
ExaminesPATTON, PAUL E
Art Unit2822
Technology Center2800
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