Local interconnect structures for high density | Patent Number 09024418

US 09024418 B2
Application Number13829864
Publication NumberUS 20140264629 A1
Pendency2 years, 1 month, 22 days
Filled DateMar 14, 2013
Priority DateMar 14, 2013
Publication DateSep 18, 2014
Expiration DateMar 13, 2033
Inventor/ApplicantsPR Chidambaram
Giridhar Nallapati
John Jianhong Zhu
ExaminesPATTON, PAUL E
Art Unit2822
Technology Center2800
Assignments
Qualcomm Technologies Inc.
Current
Qualcomm Technologies Inc.
Original
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