Local interconnect structures for high density | Patent Publication Number 20140264629

US 20140264629 A1

Patent NumberUS 09024418 B2

Application Number13829864

Filled DateMar 14, 2013

Priority DateMar 14, 2013

Publication DateSep 18, 2014

Original AssigneeQualcomm Technologies Inc.

Current AssigneeQualcomm Technologies Inc.

Inventor/ApplicantsJohn Jianhong Zhu
Giridhar Nallapati
PR Chidambaram

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