High deposition rate sputtering | Patent Number 06896773

US 06896773 B2
Application Number10065739
Publication NumberUS 20040094411 A1
Pendency2 years, 6 months, 12 days
Filled DateNov 14, 2002
Priority DateNov 14, 2002
Publication DateMay 20, 2004
Expiration DateNov 14, 2022
Inventor/ApplicantsRoman Chistyakov
Roman Chistyakov
ExaminesMCDONALD, RODNEY GLENN
Art Unit1753
Technology Center1700
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