High deposition rate sputtering | Patent Publication Number 20040094411

US 20040094411 A1
Patent NumberUS 06896773 B2
Application Number10065739
Filled DateNov 14, 2002
Priority DateNov 14, 2002
Publication DateMay 20, 2004
Original AssigneeZond
Current AssigneeZond
Inventor/ApplicantsRoman Chistyakov
Roman Chistyakov
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