High deposition rate sputtering | Patent Number 07811421

US 07811421 B2
Application Number11183463
Publication NumberUS 20050252763 A1
Pendency5 years, 2 months, 27 days
Filled DateJul 18, 2005
Priority DateMar 28, 2005
Publication DateNov 17, 2005
Expiration DateOct 12, 2018
Inventor/ApplicantsRoman Chistyakov
ExaminesMCDONALD, RODNEY GLENN
Art Unit1795
Technology Center1700
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